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公开(公告)号：US20190067062A1
公开(公告)日：2019-02-28
申请号：US16116101
申请日：2018-08-29
发明人： Sunna Chang , Ryan Park , Jin Chae , Matthew Whitlock , Jonathan Lie , Athens Okoren
IPC分类号： H01L21/673
摘要： Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
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公开(公告)号：US12106988B2
公开(公告)日：2024-10-01
申请号：US17651718
申请日：2022-02-18
发明人： Sunna Chung , Ryan Park , Jin Chae , Matthew Stanton Whitlock , Jonathan Kevin Lie , Athens Okoren
IPC分类号： B65D85/48 , H01L21/673
CPC分类号： H01L21/67383 , H01L21/67346 , H01L21/67366 , H01L21/67373 , H01L21/67326
摘要： Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
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公开(公告)号：US20220310494A1
公开(公告)日：2022-09-29
申请号：US17806657
申请日：2022-06-13
发明人： Sunna Chung , John Kim , Ryan Park , Denny Kwon , Matthew Whitlock , Athens Okoren
IPC分类号： H01L23/495 , H01L23/00 , H01L21/673 , B29C51/26 , H01L21/683
摘要： Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.
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公开(公告)号：US20190067061A1
公开(公告)日：2019-02-28
申请号：US16116075
申请日：2018-08-29
发明人： Sunna Chang , John Kim , Ryan Park , Matthew Whitlock , Athens Okoren
IPC分类号： H01L21/673 , H01L23/60
摘要： Introduced here are carrier trays that include an adhesive film affixed to a deck area. For example, the adhesive film may be integrally laminated onto the top surface of the carrier tray as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the carrier tray. Semiconductor component(s) can be secured to the carrier tray based on the adhesiveness of the adhesive film. Said another way, proper securement of the semiconductor component(s) to the carrier tray may depend on the tackiness of the constituent material(s) of the adhesive film.
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公开(公告)号：US11764133B2
公开(公告)日：2023-09-19
申请号：US17806657
申请日：2022-06-13
发明人： Sunna Chung , John Kim , Ryan Park , Denny Kwon , Matthew Whitlock , Athens Okoren
IPC分类号： H01L23/495 , H01L23/00 , H01L21/673 , B29C51/26 , B29C49/22 , B29C51/00 , H01L21/683 , B29L31/00 , B29C49/42 , B29L7/00
CPC分类号： H01L23/49572 , B29C51/266 , H01L21/67333 , H01L21/6835 , H01L24/32 , H01L24/50 , B29C49/4273 , B29C51/00 , B29L2007/007 , B29L2031/7164 , H01L24/75 , H01L2221/68313 , H01L2224/7565 , Y10T156/1023 , Y10T156/1039 , Y10T156/1043 , Y10T156/1075 , Y10T156/1077 , Y10T156/1089 , Y10T156/1092 , Y10T156/1097
摘要： Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.
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公开(公告)号：US20230005771A1
公开(公告)日：2023-01-05
申请号：US17651718
申请日：2022-02-18
发明人： Sunna Chung , Ryan Park , Jin Chae , Matthew Stanton Whitlock , Jonathan Kevin Lie , Athens Okoren
IPC分类号： H01L21/673
摘要： Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
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公开(公告)号：US20190067173A1
公开(公告)日：2019-02-28
申请号：US16116092
申请日：2018-08-29
发明人： Sunna Chang , John Kim , Ryan Park , Denny Kwon , Matthew Whitlock , Athens Okoren
IPC分类号： H01L23/495 , H01L23/00
摘要： Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongate carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.
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公开(公告)号：US20220384226A1
公开(公告)日：2022-12-01
申请号：US17819450
申请日：2022-08-12
IPC分类号： H01L21/673 , B29C45/00 , B29C45/14
摘要： Introduced here are carrier assemblies designed to address the limitations of conventional carrier trays. A carrier assembly can comprise a primary injection-molded component having a deck area for receiving semiconductor components and a secondary injection-molded component that is secured to the deck area of the primary injection-molded component. For example, the secondary injection-molded component may be overmolded on the deck area of the primary injection-molded component. The secondary injection-molded component may have a tacky upper surface that facilitates securement of the semiconductor components to the primary injection-molded component.
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公开(公告)号：US11362025B2
公开(公告)日：2022-06-14
申请号：US16116840
申请日：2018-08-29
发明人： Sunna Chung , John Kim , Ryan Park , Denny Kwon , Matthew Whitlock , Athens Okoren
IPC分类号： H01L23/495 , H01L23/00 , H01L21/673 , B29C51/26 , H01L21/683 , B29C49/42 , B29C51/00 , B29L31/00 , B29L7/00
摘要： Introduced here are carrier tape assemblies that can improve efficiency and reduce costs when utilized in the handling, transport, or storage of semiconductor components. A carrier tape assembly can include an adhesive film affixed to an elongated and/or extruded carrier tape. For example, the adhesive film may be integrally laminated onto the top surface of the elongate carrier tape as a single continuous (i.e., unbroken) sheet. The adhesive film may substantially conform to the top surface of the elongate carrier tape, including any punched cavities for holding semiconductor components. Proper securement of the semiconductor components to the carrier tape assembly depends on the adhesive property of the constituent material(s) of the adhesive film.
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公开(公告)号：US11257700B2
公开(公告)日：2022-02-22
申请号：US16116847
申请日：2018-08-29
发明人： Sunna Chung , Ryan Park , Jin Chae , Matthew Whitlock , Jonathan Lie , Athens Okoren
IPC分类号： B65D85/48 , H01L21/673
摘要： Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
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