Invention Grant
- Patent Title: Flex on board anisotropic conductive adhesive interconnection
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Application No.: US16770483Application Date: 2017-12-22
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Publication No.: US11259414B2Publication Date: 2022-02-22
- Inventor: David Powney , Ilkka Saarinen , Mikko Kylkilahti , Lei Han
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Hauptman Ham, LLP
- International Application: PCT/EP2017/084519 WO 20171222
- International Announcement: WO2019/120583 WO 20190627
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/32 ; H05K1/18 ; H05K3/36
Abstract:
An apparatus includes a printed circuit board and a flexible printed circuit. A rigid structure component is on a first side of the printed circuit board. An interconnection interface is on a second side of the printed circuit board opposite to the rigid structure component and is configured to interconnect the flexible printed circuit and the printed circuit board. A conductive interconnection material is at the interconnection interface between the flexible printed circuit and the printed circuit board.
Information query
