Invention Grant
- Patent Title: Apparatus for reducing fabric dimpling in electronic devices and associated methods
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Application No.: US16983529Application Date: 2020-08-03
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Publication No.: US11260639B2Publication Date: 2022-03-01
- Inventor: Phanindraja Ancha , Yu Wei Chen , Brian Huynh
- Applicant: Google LLC
- Applicant Address: US CA Mountain View
- Assignee: Google LLC
- Current Assignee: Google LLC
- Current Assignee Address: US CA Mountain View
- Agency: Byrne Poh LLP
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B32B37/12 ; H04R31/00

Abstract:
The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are “proud” (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.
Public/Granted literature
- US20220032595A1 Apparatus for Reducing Fabric Dimpling in Electronic Devices and Associated Methods Public/Granted day:2022-02-03
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