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    PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPARATUSES AND METHODS
    1.
    发明申请
    PASSIVE THERMAL-CONTROL STRUCTURE FOR SPEAKERS AND ASSOCIATED APPARATUSES AND METHODS 有权

    公开(公告)号：US20240397669A1

    公开(公告)日：2024-11-28

    申请号：US18794812

    申请日：2024-08-05

    Applicant: Google LLC

    Inventor： Emil Rahim ,  Ihab A. Ali ,  Phanindraja Ancha ,  Neha Ravi Dixit

    IPC: H05K7/20 ,  H04R1/02

    Abstract: The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and can provide both thermal mitigation and structural stability. The passive thermal-control structure can conduct heat from the electronic subsystems to a housing of the electronic speaker device.

    Passive thermal-control structure for speakers and associated apparatuses and methods
    2.
    发明授权
    Passive thermal-control structure for speakers and associated apparatuses and methods 有权

    公开(公告)号：US12082377B2

    公开(公告)日：2024-09-03

    申请号：US17407789

    申请日：2021-08-20

    Applicant: Google LLC

    Inventor： Emil Rahim ,  Ihab A. Ali ,  Phanindraja Ancha ,  Neha Ravi Dixit

    IPC: H04R1/02 ,  H05K7/20

    CPC classification number: H05K7/20418 ,  H04R1/025 ,  H05K7/20481 ,  H05K7/205 ,  H05K7/20509 ,  H05K7/20409

    Abstract: The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits.

    Compact speaker device
    5.
    发明授权
    Compact speaker device 有权

    公开(公告)号：US11011168B2

    公开(公告)日：2021-05-18

    申请号：US16285061

    申请日：2019-02-25

    Applicant: GOOGLE LLC

    Inventor： Frédéric Heckmann ,  Yau-Shing Lee ,  Robert Rose ,  Jun Hou ,  Patanjali Peri ,  Phanindraja Ancha

    IPC: H04R1/02 ,  G10L15/22 ,  G06F1/20 ,  H04M1/03 ,  H04R1/34 ,  H04R9/02 ,  H05K7/20 ,  H04M1/60 ,  H04R27/00 ,  G10K11/26 ,  H05K1/02

    Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.

    APPARATUS FOR REDUCING FABRIC DIMPLING IN ELECTRONIC DEVICES AND ASSOCIATED METHODS
    7.
    发明申请
    APPARATUS FOR REDUCING FABRIC DIMPLING IN ELECTRONIC DEVICES AND ASSOCIATED METHODS 有权

    公开(公告)号：US20220176685A1

    公开(公告)日：2022-06-09

    申请号：US17682188

    申请日：2022-02-28

    Applicant: Google LLC

    Inventor： Phanindraja Ancha ,  Yu Wei Chen ,  Brian Huynh

    IPC: B32B37/00 ,  H04R31/00 ,  B32B37/12

    Abstract: The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are “proud” (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.

    Apparatus for reducing fabric dimpling in electronic devices and associated methods
    8.
    发明授权
    Apparatus for reducing fabric dimpling in electronic devices and associated methods 有权

    公开(公告)号：US11260639B2

    公开(公告)日：2022-03-01

    申请号：US16983529

    申请日：2020-08-03

    Applicant: Google LLC

    Inventor： Phanindraja Ancha ,  Yu Wei Chen ,  Brian Huynh

    IPC: B32B37/00 ,  B32B37/12 ,  H04R31/00

    Abstract: The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are “proud” (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.

    Passive Thermal-Control Structure for Speakers and Associated Apparatuses and Methods
    9.
    发明申请
    Passive Thermal-Control Structure for Speakers and Associated Apparatuses and Methods 有权

    公开(公告)号：US20210410334A1

    公开(公告)日：2021-12-30

    申请号：US17407789

    申请日：2021-08-20

    Applicant: Google LLC

    Inventor： Emil Rahim ,  Ihab A. Ali ,  Phanindraja Ancha ,  Neha Ravi Dixit

    IPC: H05K7/20 ,  H04R1/02

    Abstract: The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits

    Compact Speaker Device
    10.
    发明申请
    Compact Speaker Device 有权

    公开(公告)号：US20210233531A1

    公开(公告)日：2021-07-29

    申请号：US17230247

    申请日：2021-04-14

    Applicant: Google LLC

    Inventor： Frédéric Heckmann ,  Yau-Shing Lee ,  Robert Rose ,  Jun Hou ,  Patanjali Sastry Peri ,  Phanindraja Ancha

    IPC: G10L15/22 ,  G06F1/20 ,  H04M1/03 ,  H04R1/34 ,  H04R9/02 ,  H05K7/20

    Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.

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