Invention Grant
- Patent Title: HGP component with effusion cooling element having coolant swirling chamber
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Application No.: US16360177Application Date: 2019-03-21
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Publication No.: US11262074B2Publication Date: 2022-03-01
- Inventor: Jonathan Dwight Berry , Michael Hughes , Srikanth Chandrudu Kottilingam
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Hoffman Warnick
- Main IPC: F23R3/28
- IPC: F23R3/28 ; F23R3/00 ; F01D9/02 ; F23R3/06

Abstract:
An effusion cooling element for the surface of a hot gas path (HGP) component is disclosed. The effusion cooling element includes a coolant swirling chamber embedded within the body of the HGP component. A coolant delivery passage is in the body and configured to deliver a coolant to the coolant swirling chamber. The coolant swirling chamber imparts a centrifugal force to the coolant. An effusion opening is in the HGP surface and in fluid communication with the coolant swirling chamber, the effusion opening having a smaller width than the coolant swirling chamber. The coolant exits the effusion opening over substantially all of 360° about the effusion opening, creating a coolant film on the HGP surface.
Public/Granted literature
- US20200300165A1 HGP COMPONENT WITH EFFUSION COOLING ELEMENT HAVING COOLANT SWIRLING CHAMBER Public/Granted day:2020-09-24
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