公开(公告)号：US20200300165A1

公开(公告)日：2020-09-24

申请号：US16360177

申请日：2019-03-21

Applicant: General Electric Company

Inventor： Jonathan Dwight Berry ,  Michael Hughes ,  Srikanth Chandrudu Kottilingam

IPC: F02C7/141 ,  F23R3/28 ,  F02C3/04

Abstract: An effusion cooling element for the surface of a hot gas path (HGP) component is disclosed. The effusion cooling element includes a coolant swirling chamber embedded within the body of the HGP component. A coolant delivery passage is in the body and configured to deliver a coolant to the coolant swirling chamber. The coolant swirling chamber imparts a centrifugal force to the coolant. An effusion opening is in the HGP surface and in fluid communication with the coolant swirling chamber, the effusion opening having a smaller width than the coolant swirling chamber. The coolant exits the effusion opening over substantially all of 360° about the effusion opening, creating a coolant film on the HGP surface.

公开(公告)号：US11262074B2

公开(公告)日：2022-03-01

申请号：US16360177

申请日：2019-03-21

Applicant: General Electric Company

Inventor： Jonathan Dwight Berry ,  Michael Hughes ,  Srikanth Chandrudu Kottilingam

IPC: F23R3/28 ,  F23R3/00 ,  F01D9/02 ,  F23R3/06

Abstract: An effusion cooling element for the surface of a hot gas path (HGP) component is disclosed. The effusion cooling element includes a coolant swirling chamber embedded within the body of the HGP component. A coolant delivery passage is in the body and configured to deliver a coolant to the coolant swirling chamber. The coolant swirling chamber imparts a centrifugal force to the coolant. An effusion opening is in the HGP surface and in fluid communication with the coolant swirling chamber, the effusion opening having a smaller width than the coolant swirling chamber. The coolant exits the effusion opening over substantially all of 360° about the effusion opening, creating a coolant film on the HGP surface.