Invention Grant
- Patent Title: Electronic component
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Application No.: US16986712Application Date: 2020-08-06
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Publication No.: US11264171B2Publication Date: 2022-03-01
- Inventor: Yuichi Nagai , Takehisa Tamura , Shinya Onodera , Ken Morita , Atsushi Takeda
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2019-147540 20190809
- Main IPC: H01G4/248
- IPC: H01G4/248 ; H01G4/12 ; H01G4/012 ; H01G4/30

Abstract:
A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm) and a maximum thickness of the second region is T2 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1≥0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.
Public/Granted literature
- US20210043385A1 ELECTRONIC COMPONENT Public/Granted day:2021-02-11
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