Invention Grant
- Patent Title: Spring bar leadframe, method and packaged electronic device with zero draft angle
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Application No.: US16892527Application Date: 2020-06-04
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Publication No.: US11264310B2Publication Date: 2022-03-01
- Inventor: Lee Han Meng Eugene Lee , Anis Fauzi Bin Abdul Aziz , Sueann Wei Fen Lim , Jin Keong Lim
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L21/78 ; H01L23/00 ; H01L21/48 ; H01L23/31
Abstract:
A method includes attaching semiconductor dies to die attach pads of first and second columns of the lead frame; enclosing the semiconductor dies of the respective columns in respective first and second package structures; trimming the lead frame to separate respective first and second lead portions of adjacent ones of the first and second columns of the lead frame; moving the first columns along a column direction relative to the second columns; and separating individual packaged electronic devices of the respective first and second columns from one another.
Public/Granted literature
- US20210384110A1 SPRING BAR LEADFRAME, METHOD AND PACKAGED ELECTRONIC DEVICE WITH ZERO DRAFT ANGLE Public/Granted day:2021-12-09
Information query
IPC分类:
