公开(公告)号：US20220223503A1

公开(公告)日：2022-07-14

申请号：US17683768

申请日：2022-03-01

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@Eugene Lee ,  Anis Fauzi Bin Abdul Aziz ,  Sueann Wei Fen Lim ,  Jin Keong Lim

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L21/48 ,  H01L23/31

Abstract: A method includes attaching semiconductor dies to die attach pads of first and second columns of the lead frame; enclosing the semiconductor dies of the respective columns in respective first and second package structures; trimming the lead frame to separate respective first and second lead portions of adjacent ones of the first and second columns of the lead frame; moving the first columns along a column direction relative to the second columns; and separating individual packaged electronic devices of the respective first and second columns from one another.

公开(公告)号：US12087674B2

公开(公告)日：2024-09-10

申请号：US17683768

申请日：2022-03-01

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng@Eugene Lee ,  Anis Fauzi Bin Abdul Aziz ,  Sueann Wei Fen Lim ,  Jin Keong Lim

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49513 ,  H01L24/32 ,  H01L24/83 ,  H01L24/97 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/73265

Abstract: A method includes attaching semiconductor dies to die attach pads of first and second columns of the lead frame; enclosing the semiconductor dies of the respective columns in respective first and second package structures; trimming the lead frame to separate respective first and second lead portions of adjacent ones of the first and second columns of the lead frame; moving the first columns along a column direction relative to the second columns; and separating individual packaged electronic devices of the respective first and second columns from one another.

公开(公告)号：US11264310B2

公开(公告)日：2022-03-01

申请号：US16892527

申请日：2020-06-04

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng Eugene Lee ,  Anis Fauzi Bin Abdul Aziz ,  Sueann Wei Fen Lim ,  Jin Keong Lim

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L21/48 ,  H01L23/31

Abstract: A method includes attaching semiconductor dies to die attach pads of first and second columns of the lead frame; enclosing the semiconductor dies of the respective columns in respective first and second package structures; trimming the lead frame to separate respective first and second lead portions of adjacent ones of the first and second columns of the lead frame; moving the first columns along a column direction relative to the second columns; and separating individual packaged electronic devices of the respective first and second columns from one another.

公开(公告)号：US20210384110A1

公开(公告)日：2021-12-09

申请号：US16892527

申请日：2020-06-04

Applicant: Texas Instruments Incorporated

Inventor： Lee Han Meng Eugene Lee ,  Anis Fauzi Bin Abdul Aziz ,  Sueann Wei Fen Lim ,  Jin Keong Lim

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L21/48 ,  H01L23/31

Abstract: A method includes attaching semiconductor dies to die attach pads of first and second columns of the lead frame; enclosing the semiconductor dies of the respective columns in respective first and second package structures; trimming the lead frame to separate respective first and second lead portions of adjacent ones of the first and second columns of the lead frame; moving the first columns along a column direction relative to the second columns; and separating individual packaged electronic devices of the respective first and second columns from one another.

公开(公告)号：US20150250063A1

公开(公告)日：2015-09-03

申请号：US14713062

申请日：2015-05-15

Applicant: Texas Instruments Incorporated

Inventor： Mohamed Ashraf Mohd Arshad ,  Jin Keong Lim

IPC: H05K5/02

CPC classification number: G06F1/203 ,  H01L23/373 ,  H01L23/42 ,  H01L2924/0002 ,  H05K5/02 ,  H01L2924/00

Abstract: A molded system has a plurality of components attached to a carrier, one of the components being an inductor of high thermal capacitance. The surface of the inductor is sealed with a polymeric layer of high thermal resistance, whereby the layer thermally insulates the inductor and inhibits the transport of thermal energy between the inductor and the system.

Abstract translation: 模制系统具有附接到载体的多个部件，其中一个部件是具有高热容的电感器。 电感器的表面由具有高热阻的聚合物层密封，由此该层使电感器绝热，并抑制电感和系统之间的热能传递。