Invention Grant
- Patent Title: Connection of several circuits of an electronic chip
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Application No.: US16901449Application Date: 2020-06-15
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Publication No.: US11264324B2Publication Date: 2022-03-01
- Inventor: Samuel Boscher , Yann Rebours , Michel Cuenca
- Applicant: STMicroelectronics (Grenoble 2) SAS , STMicroelectronics (Rousset) SAS
- Applicant Address: FR Grenoble; FR Rousset
- Assignee: STMicroelectronics (Grenoble 2) SAS,STMicroelectronics (Rousset) SAS
- Current Assignee: STMicroelectronics (Grenoble 2) SAS,STMicroelectronics (Rousset) SAS
- Current Assignee Address: FR Grenoble; FR Rousset
- Agency: Crowe & Dunlevy
- Priority: FR1906583 20190619
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/50 ; H01L23/522

Abstract:
An electronic chip disclosed herein includes a plurality of IP core circuits, with a shared strip that is at least partially conductive and is linked to a node for applying a fixed potential. A plurality of tracks electrically links the plurality of IP core circuits to the shared strip. Each individual track of the plurality of tracks solely links a single one of said IP core circuits to the shared strip.
Information query
IPC分类: