Invention Grant
- Patent Title: Interconnects having a portion without a liner material and related structures, devices, and methods
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Application No.: US16628991Application Date: 2017-09-28
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Publication No.: US11264325B2Publication Date: 2022-03-01
- Inventor: Manish Chandhok , Richard Schenker , Tristan Tronic
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2017/054018 WO 20170928
- International Announcement: WO2019/066855 WO 20190404
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/768 ; H01L23/532

Abstract:
Integrated circuit (IC) structures, computing devices, and related methods are disclosed. An IC structure includes an interlayer dielectric (ILD), an interconnect, and a liner material separating the interconnect from the ILD. The interconnect includes a first end extending to or into the ILD and a second end opposite the first end. A second portion of the interconnect extending from the second end to a first portion of the interconnect proximate to the first end does not include the liner material thereon. A method of manufacturing an IC structure includes removing an ILD from between interconnects, applying a conformal hermetic liner, applying a carbon hard mask (CHM) between the interconnects, removing a portion of the CHM, removing the conformal hermetic liner to a remaining CHM, and removing the exposed portion of the liner material to the remaining CHM to expose the second portion of the interconnects.
Information query
IPC分类: