Invention Grant
- Patent Title: Electromagnetic wave absorber, article with electromagnetic wave absorber, and method for manufacturing electromagnetic wave absorber
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Application No.: US16957885Application Date: 2018-12-28
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Publication No.: US11266048B2Publication Date: 2022-03-01
- Inventor: Kazuto Yamagata , Hironobu Machinaga , Hiroichi Ukei , Takehiro Ui
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JPJP2017-253475 20171228
- International Application: PCT/JP2018/048541 WO 20181228
- International Announcement: WO2019/132027 WO 20190704
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H01Q17/00

Abstract:
An electromagnetic wave absorber (1a) includes a resistive layer (10), an electrically conductive layer (20) and a dielectric layer (30). The electrically conductive layer (20) has a sheet resistance lower than a sheet resistance of the resistive layer (10). The dielectric layer (30) is disposed between the resistive layer (10) and the electrically conductive layer (20). The electromagnetic wave absorber (1a) has a first slit (15). The first slit (15) extends, in the resistive layer (10), from a first principal surface (10a) distal to the dielectric layer (30) toward the dielectric layer (30) in a direction perpendicular to the first principal surface (10a) and divides the resistive layer (10) into a plurality of first blocks (17). Each of the first blocks (17) has a minimum dimension (D1) of 2 mm or more at the first principal surface (10a).
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