Invention Grant
- Patent Title: Coil component
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Application No.: US16664062Application Date: 2019-10-25
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Publication No.: US11270829B2Publication Date: 2022-03-08
- Inventor: Yong Sam Lee , Eo Jin Choi , Jae Hun Kim , Ji Hyun Eom , Hye Yeon Cha
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2016-0142182 20161028,KR10-2016-0152020 20161115
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/02 ; H01F27/29 ; H01F17/00 ; H01F27/24 ; H01F17/04

Abstract:
A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.
Public/Granted literature
- US20200058431A1 COIL COMPONENT Public/Granted day:2020-02-20
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