公开(公告)号：US20140353025A1

公开(公告)日：2014-12-04

申请号：US14224728

申请日：2014-03-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Deok Suk JANG ,  Yong Sam Lee

IPC: H05K1/11 ,  H05K13/00

CPC classification number: H05K3/421 ,  H05K3/0035 ,  H05K2201/09563 ,  H05K2201/09827 ,  Y10T29/49124

Abstract: A printed circuit board includes a first insulating layer; a pad formed on the first insulating layer; a second insulating layer covered on the first insulating layer having the pad thereon; and a via hole formed in the second insulating layer. The pad has a surface that is non-planar.

Abstract translation: 印刷电路板包括第一绝缘层; 衬垫，形成在所述第一绝缘层上; 覆盖在其上的所述第一绝缘层上的第二绝缘层; 以及形成在第二绝缘层中的通孔。 垫具有非平面的表面。

公开(公告)号：US10529476B2

公开(公告)日：2020-01-07

申请号：US15665263

申请日：2017-07-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Sik Park ,  Sang Jae Lee ,  Youn Soo Seo ,  Yong Sam Lee ,  Hye Yeon Cha ,  Jae Ha Kim

IPC: H01F5/00 ,  H01F5/04 ,  H01F41/04

Abstract: A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.

公开(公告)号：US20150173197A1

公开(公告)日：2015-06-18

申请号：US14453289

申请日：2014-08-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Hyeon Cho ,  Yong Sam Lee ,  Jin O Yoo

IPC: H05K1/18 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K1/185 ,  H01F17/0013 ,  H01F17/04 ,  H01F27/255 ,  H01F41/046 ,  H05K3/4602 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49075

Abstract: A printed circuit board having an inductor embedded therein may include a conductive coil part embedded in an insulating layer; and a magnetic material part integrally formed so as to enclose a vicinity of the conductive coil part. In the printed circuit board having the inductor embedded therein, a gap between coils is narrowed and coils having a high height and a narrow width are formed, whereby resistance may be decreased and a higher inductance value may be implemented in a narrow area.

Abstract translation: 具有嵌入其中的电感器的印刷电路板可以包括嵌入在绝缘层中的导电线圈部分; 以及整体形成为包围导电线圈部分附近的磁性材料部分。 在具有嵌入其中的电感器的印刷电路板中，线圈之间的间隙变窄，并且形成具有高高度和窄宽度的线圈，从而可以减小电阻并且可以在较窄的区域中实现更高的电感值。

公开(公告)号：US10045436B2

公开(公告)日：2018-08-07

申请号：US14537998

申请日：2014-11-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Hyeon Cho ,  Hyo Seung Nam ,  Yong Sam Lee ,  Seok Hwan Ahn

IPC: H05K1/02 ,  H05K3/42 ,  H05K3/00 ,  H05K3/46 ,  H05K1/11 ,  H05K1/03 ,  H01L23/00

Abstract: A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.

公开(公告)号：US09331009B2

公开(公告)日：2016-05-03

申请号：US14461800

申请日：2014-08-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Woon Chul Choi ,  Yong Sam Lee ,  Hwan Soo Lee

IPC: H01L21/4763 ,  H01L23/498 ,  H01L21/48 ,  H01F17/00 ,  H01F27/28

CPC classification number: H01L23/49827 ,  H01F17/0013 ,  H01F27/292 ,  H01F41/046 ,  H01F2017/002 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01L21/486 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A chip electronic component may be capable of improving connectivity between internal coils formed on upper and lower surfaces of an insulating substrate and preventing loss of inductance due to the areas of via pads by decreasing sizes of the outermost via electrodes and decreasing sizes of the via pad.

Abstract translation: 芯片电子部件可以能够改善形成在绝缘基板的上表面和下表面上的内部线圈之间的连接性，并且通过减小最外通孔电极的尺寸和减小通孔焊盘的尺寸来防止由于通孔焊盘区域引起的电感损失 。

公开(公告)号：US10485105B2

公开(公告)日：2019-11-19

申请号：US15712787

申请日：2017-09-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Sam Lee ,  Won Joong Kim

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/42

Abstract: A substrate including a through hole only in one of a direction from a top surface to a bottom surface of the substrate or a direction from a bottom surface to a top surface of the substrate, a protruding portion of a metal layer protruding toward the through hole being removed, and a plating layer on an inner surface of the substrate on at least the through hole.

公开(公告)号：US11270829B2

公开(公告)日：2022-03-08

申请号：US16664062

申请日：2019-10-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Sam Lee ,  Eo Jin Choi ,  Jae Hun Kim ,  Ji Hyun Eom ,  Hye Yeon Cha

IPC: H01F27/32 ,  H01F27/02 ,  H01F27/29 ,  H01F17/00 ,  H01F27/24 ,  H01F17/04

Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.

公开(公告)号：US10916366B2

公开(公告)日：2021-02-09

申请号：US15875298

申请日：2018-01-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Sam Lee

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/12 ,  H01F41/04 ,  H01F17/04 ,  H01F17/00 ,  H01F1/34

Abstract: An inductor includes a body including an insulating portion formed of a plurality of layers and a magnetic portion surrounding the insulating portion and external electrodes disposed on external surfaces of the body, and a method of manufacturing the same. A coil portion is embedded in the insulating portion, and has a structure in which coil patterns formed on a plurality of layers are stacked while being connected to each other.

公开(公告)号：US10580566B2

公开(公告)日：2020-03-03

申请号：US15961291

申请日：2018-04-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ju Hwan Yang ,  Yong Sam Lee ,  Young Seuck Yoo

IPC: H01F27/02 ,  H01F27/28 ,  H01F27/29 ,  H01F41/061 ,  H01F27/255 ,  H01F27/245 ,  H01F17/00 ,  H01F17/04

Abstract: A winding-type inductor includes a body including a winding-type coil and first and second external electrodes disposed on external surfaces of the body. The body includes the winding-type coil, and first and second connection reinforcing portions are additionally arranged on first and second ends of the winding-type coil and directly connected to the first and second external electrodes.