Invention Grant
- Patent Title: Apparatus with species on or in conductive material on elongate lines
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Application No.: US16773636Application Date: 2020-01-27
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Publication No.: US11270909B2Publication Date: 2022-03-08
- Inventor: Gurtej S. Sandhu , Marko Milojevic , John A. Smythe , Timothy A. Quick , Sumeet C. Pandey
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/67 ; H01L23/522 ; H01L23/528 ; H01L23/538
Abstract:
A method of forming a structure comprises forming a pattern of elongate features extending vertically from a base structure. Conductive material is formed on the elongate features. After completing the forming of the pattern of elongate features, the elongate features, the conductive material, or both is (are) exposed to at least one surface treatment gas. The at least one surface treatment gas comprises at least one species formulated to diminish attractive or cohesive forces at a surface of the conductive material. Apparatus and additional methods are also described.
Public/Granted literature
- US20210233810A1 METHODS FOR INHIBITING LINE BENDING DURING CONDUCTIVE MATERIAL DEPOSITION, AND RELATED APPARATUS Public/Granted day:2021-07-29
Information query
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