Invention Grant
- Patent Title: Enabling magnetic films in inductors integrated into semiconductor packages
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Application No.: US15933599Application Date: 2018-03-23
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Publication No.: US11270959B2Publication Date: 2022-03-08
- Inventor: Kirstof Darmawikarta , Srinivas Pietambaram , Prithwish Chatterjee , Sri Ranga Sai Boyapati , Wei Lun Jen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/64
- IPC: H01L23/64 ; H01F27/28 ; H01F1/14 ; H01F1/34 ; H01L23/498 ; H01L21/48 ; H01L23/00 ; H01F41/04

Abstract:
Techniques for fabricating a semiconductor package comprising inductor features and a magnetic film are described. For one technique, fabricating a package includes: forming inductor features comprising a pad and a conductive line on a first build-up layer; forming a raised pad structure on the first build-up layer by fabricating a pillar structure on the pad, wherein a size of the pillar structure is approximately equal or equal to a corresponding size of the pad such that the pillar structure and the pad are aligned or minimally misaligned relative to each other; encapsulating the inductor features and the raised pad structure in a magnetic film; planarizing the magnetic film until top surfaces of the raised pad structure and magnetic film are co-planar; depositing an additional layer on the top surfaces; and forming a via on the raised pad structure by removing portions of the additional layer above the raised pad structure.
Public/Granted literature
- US20190295967A1 ENABLING MAGNETIC FILMS IN INDUCTORS INTEGRATED INTO SEMICONDUCTOR PACKAGES Public/Granted day:2019-09-26
Information query
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