- Patent Title: Printed circuit board and package including printed circuit board
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Application No.: US16674460Application Date: 2019-11-05
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Publication No.: US11272613B2Publication Date: 2022-03-08
- Inventor: Tae-Hong Min , Ju-Ho Kim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2018-0154667 20181204
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/02 ; H01Q1/22 ; H05K1/14 ; H05K1/11 ; H05K1/18

Abstract:
A printed circuit board includes: a laminate including a core layer and insulating layers stacked on first and second sides of the core layer; and a first antenna formed on a surface of the laminate. A thickness of the core layer is greater than a thickness of one of the insulating layers. A dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers.
Public/Granted literature
- US20200178389A1 PRINTED CIRCUIT BOARD AND PACKAGE INCLUDING PRINTED CIRCUIT BOARD Public/Granted day:2020-06-04
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