公开(公告)号：US11013114B2

公开(公告)日：2021-05-18

申请号：US16661051

申请日：2019-10-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Seon-Ha Kang ,  Sa-Yong Lee ,  Mi-Sun Hwang ,  Ju-Ho Kim

IPC: H05K1/11 ,  H05K3/42

Abstract: A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.

公开(公告)号：US11430737B2

公开(公告)日：2022-08-30

申请号：US16537923

申请日：2019-08-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho-Hyung Ham ,  Sa-Yong Lee ,  Ju-Ho Kim

IPC: H01L23/538 ,  H01L23/00 ,  H01L21/48

Abstract: Provided is a printed circuit board including a laminate that is formed by vertically stacking a plurality of insulating layers including a rigid insulating layer, a flexible insulating layer having a first region in vertical contact with at least one of the plurality of insulating layers and a second region located on an outer side of the laminate, and a first electronic element embedded in the flexible insulating layer.

公开(公告)号：US11272613B2

公开(公告)日：2022-03-08

申请号：US16674460

申请日：2019-11-05

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae-Hong Min ,  Ju-Ho Kim

IPC: H05K1/03 ,  H05K1/02 ,  H01Q1/22 ,  H05K1/14 ,  H05K1/11 ,  H05K1/18

Abstract: A printed circuit board includes: a laminate including a core layer and insulating layers stacked on first and second sides of the core layer; and a first antenna formed on a surface of the laminate. A thickness of the core layer is greater than a thickness of one of the insulating layers. A dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers.

公开(公告)号：US11166365B2

公开(公告)日：2021-11-02

申请号：US16663397

申请日：2019-10-25

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： A-ran Lee ,  Kee-Ju Um ,  Ju-Ho Kim ,  Myeong-Hui Jung ,  Kyuong-Hwan Lim ,  Jin-Won Lee ,  Seung-On Kang ,  Jong-Guk Kim

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/42 ,  H05K3/06

Abstract: A printed circuit board includes: a first insulating layer; and a heat radiating circuit pattern disposed on a first surface of the first insulating layer and having a pad and a via. The heat radiating circuit pattern includes: a first metal layer disposed on the first insulating layer; a graphite layer disposed on the first metal layer; and a second metal layer disposed on the graphite layer.

公开(公告)号：US11122694B2

公开(公告)日：2021-09-14

申请号：US16676493

申请日：2019-11-07

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Tae-Hong Min ,  Ju-Ho Kim

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/22 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46 ,  G06K19/077

Abstract: A printed circuit board including: a laminate having a plurality of stacked insulating layers including a rigid insulating layer; a flexible insulating layer having a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate.