Invention Grant
- Patent Title: Semiconductor package having UBM pad with gap separating central portion from peripheral portion
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Application No.: US16905560Application Date: 2020-06-18
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Publication No.: US11276633B2Publication Date: 2022-03-15
- Inventor: Gayoung Kim , Duckgyu Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2019-0145924 20191114
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31

Abstract:
A semiconductor package includes; a semiconductor chip, a conductive pattern electrically connected to the semiconductor chip, a pad electrically connected to the conductive pattern, and a connection member disposed on and electrically connected to the pad. The pad includes a central portion and a peripheral portion at least partially surrounding the central portion and separated from the peripheral portion by a gap, and the connection member contacts at least one of a side surface of the central portion and an inner side surface of the peripheral portion.
Public/Granted literature
- US20210151369A1 SEMICONDUCTOR PACKAGE Public/Granted day:2021-05-20
Information query
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