- Patent Title: Disposition of a workload based on a thermal response of a device
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Application No.: US15783543Application Date: 2017-10-13
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Publication No.: US11281504B2Publication Date: 2022-03-22
- Inventor: Paul J. Gwin
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: G06F9/50
- IPC: G06F9/50 ; G06F11/34 ; G06F11/30

Abstract:
Particular embodiments described herein provide for an electronic device that can be configured to receive a plurality of thermal parameters for a device, identify one or more of the plurality of thermal parameters that affect a thermal response of the device, and create a thermal vector for the device using the one or more of the plurality of thermal parameters that affect the thermal response of the device, where the thermal vector can be used to predict a new thermal response of the device. In an example, the thermal vector includes weighted thermal parameters.
Public/Granted literature
- US20190114212A1 DISPOSITION OF A WORKLOAD BASED ON A THERMAL RESPONSE OF A DEVICE Public/Granted day:2019-04-18
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