Invention Grant
- Patent Title: Display substrate having signal vias, method for manufacturing the same, and display device having the same
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Application No.: US16624217Application Date: 2019-05-07
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Publication No.: US11282913B2Publication Date: 2022-03-22
- Inventor: Weihai Wang , Xiaochuan Chen , Shengji Yang , Pengcheng Lu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Arch & Lake LLP
- Priority: CN201810437587.0 20180509
- International Application: PCT/CN2019/085755 WO 20190507
- International Announcement: WO2019/214590 WO 20191114
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L27/32 ; H01L51/52 ; H01L51/56
Abstract:
A display substrate having a display region and at least one bonding region located on the periphery of the display region, includes: multiple first signal via holes located in the at least one bonding region and configured to provide bonding lead channels; and multiple second signal via holes located in the display region and configured to provide electrode lead channels. The diameter of each of the first signal via holes is greater than the diameter of any one second signal via hole.
Public/Granted literature
- US20210074790A1 DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY DEVICE Public/Granted day:2021-03-11
Information query
IPC分类:
