Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16760050Application Date: 2018-11-26
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Publication No.: US11282964B2Publication Date: 2022-03-22
- Inventor: Shunpei Yamazaki , Hiromi Sawai , Ryo Tokumaru , Toshihiko Takeuchi , Tsutomu Murakawa , Sho Nagamatsu , Tomoaki Moriwaka
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JPJP2017-235307 20171207,JPJP2018-030371 20180223
- International Application: PCT/IB2018/059278 WO 20181126
- International Announcement: WO2019/111091 WO 20190613
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L29/00 ; H01L29/786 ; H01L27/108 ; H01L29/04 ; H01L29/06 ; H01L29/66

Abstract:
A semiconductor device having favorable electrical characteristics is provided. The semiconductor device includes a conductor, a first insulator in contact with a side surface of the conductor, a second insulator in contact with a top surface of the conductor and a top surface of the first insulator, and an oxide over the second insulator. The oxide includes a region that overlaps with the conductor with the second insulator interposed therebetween. The maximum height of a roughness curve (Rz) of the top surface of the conductor is 6.0 nm or smaller. The region includes crystals, and c-axes of the crystals are aligned in the normal direction of the top surface of the conductor.
Public/Granted literature
- US20210210635A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2021-07-08
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