Semiconductor device and method for manufacturing semiconductor device

    公开(公告)号:US11997846B2

    公开(公告)日:2024-05-28

    申请号:US17256349

    申请日:2019-06-27

    CPC classification number: H10B12/30 G11C11/4023 H01L29/7869

    Abstract: A semiconductor device that can be miniaturized or highly integrated is provided. The semiconductor device includes an oxide; a first conductor and a second conductor provided apart from each other over the oxide; a third conductor including a region that is over the oxide and overlaps with a region between the first conductor and the second conductor; a first insulator over the third conductor; a fourth conductor that is electrically connected to the first conductor through a first opening provided in the first insulator; a second insulator that is provided over the first insulator and that is provided over the fourth conductor in the first opening; a fifth conductor overlapping with the fourth conductor with the second insulator positioned therebetween in the first opening; and a sixth conductor electrically connected to the second conductor in a second opening provided in the first insulator and the second insulator. The fifth conductor and the sixth conductor are in contact with a top surface of the second insulator over the first insulator.

    Semiconductor device and method for manufacturing the same

    公开(公告)号:US10032918B2

    公开(公告)日:2018-07-24

    申请号:US15488626

    申请日:2017-04-17

    Abstract: A highly reliable semiconductor device is provided. The semiconductor device includes a first barrier insulating film; a first gate electrode thereover; a first gate insulating film thereover; an oxide semiconductor film thereover; source and drain electrodes over the oxide semiconductor film; a second gate insulating film over the oxide semiconductor film; a second gate electrode over the second gate insulating film; a second barrier insulating film that covers the oxide semiconductor film, the source and the drain electrodes, and the second gate electrode, and is in contact with side surfaces of the oxide semiconductor film and the source and drain electrodes; and a third barrier insulating film thereover. The first to third barrier insulating films are less likely to transmit hydrogen, water, and oxygen than the first and second gate insulating films. The third barrier insulating film is thinner than the second barrier insulating film. The source and drain electrodes each includes a conductive oxide film in contact with the oxide semiconductor film. The conductive oxide film has more oxygen vacancies than the oxide semiconductor film.

    Semiconductor device
    5.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US09431541B2

    公开(公告)日:2016-08-30

    申请号:US14457257

    申请日:2014-08-12

    Abstract: To give favorable electrical characteristics to a semiconductor device. To provide a semiconductor device in which a change in electrical characteristics is suppressed. To provide a highly reliable semiconductor device. The semiconductor device includes a first insulating layer; a second insulating layer including an opening portion, over the first insulating layer; a semiconductor layer over the first insulating layer; a source electrode and a drain electrode that are apart from each other in a region overlapping with the semiconductor layer; a gate electrode overlapping with the semiconductor layer; and a gate insulating layer between the semiconductor layer and the gate electrode. The first insulating layer includes oxide, and the opening portion of the second insulating layer is positioned inside the semiconductor layer when seen from a top surface side and at least part of the opening portion is provided to overlap with the gate electrode.

    Abstract translation: 为半导体器件提供有利的电气特性。 提供抑制电特性变化的半导体器件。 提供高度可靠的半导体器件。 半导体器件包括第一绝缘层; 在所述第一绝缘层上方的包括开口部分的第二绝缘层; 在所述第一绝缘层上的半导体层; 在与半导体层重叠的区域中彼此分开的源电极和漏电极; 与半导体层重叠的栅电极; 以及在半导体层和栅电极之间的栅极绝缘层。 第一绝缘层包括氧化物,并且当从顶表面侧观察时,第二绝缘层的开口部分位于半导体层内部,并且开口部分的至少一部分被设置为与栅电极重叠。

    SEMICONDUCTOR DEVICE
    9.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20150053972A1

    公开(公告)日:2015-02-26

    申请号:US14457257

    申请日:2014-08-12

    Abstract: To give favorable electrical characteristics to a semiconductor device. To provide a semiconductor device in which a change in electrical characteristics is suppressed. To provide a highly reliable semiconductor device. The semiconductor device includes a first insulating layer; a second insulating layer including an opening portion, over the first insulating layer; a semiconductor layer over the first insulating layer; a source electrode and a drain electrode that are apart from each other in a region overlapping with the semiconductor layer; a gate electrode overlapping with the semiconductor layer; and a gate insulating layer between the semiconductor layer and the gate electrode. The first insulating layer includes oxide, and the opening portion of the second insulating layer is positioned inside the semiconductor layer when seen from a top surface side and at least part of the opening portion is provided to overlap with the gate electrode.

    Abstract translation: 为半导体器件提供有利的电气特性。 提供抑制电特性变化的半导体器件。 提供高度可靠的半导体器件。 半导体器件包括第一绝缘层; 在所述第一绝缘层上方的包括开口部分的第二绝缘层; 在所述第一绝缘层上的半导体层; 在与半导体层重叠的区域中彼此分开的源电极和漏电极; 与半导体层重叠的栅电极; 以及在半导体层和栅电极之间的栅极绝缘层。 第一绝缘层包括氧化物,并且当从顶表面侧观察时,第二绝缘层的开口部分位于半导体层内部,并且开口部分的至少一部分被设置为与栅电极重叠。

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