Invention Grant
- Patent Title: Signal combiner
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Application No.: US16557961Application Date: 2019-08-30
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Publication No.: US11283409B2Publication Date: 2022-03-22
- Inventor: Lai Kan Leung , Xinmin Yu , Chirag Dipak Patel , Rajagopalan Rangarajan
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Qualcomm Incorporated
- Main IPC: H03F1/02
- IPC: H03F1/02 ; H01P1/213 ; H03F3/60

Abstract:
In certain aspects, a receiver includes first amplifiers, wherein each one of the first amplifiers comprises an input and an output. The receiver also includes second amplifiers, wherein each one of the second amplifiers comprises an input and an output, and the outputs of the second amplifiers are coupled to a combining node. The receiver also includes transmission lines, wherein each one of the transmission lines is coupled between the output of a respective one of the first amplifiers and the input of a respective one of the second amplifiers. The receiver further includes a load coupled to the combining node, and receiver elements, wherein each one of the receiver elements comprises an input and an output, and the output of each one of the receiver elements is coupled to the input of a respective one of the first amplifiers.
Public/Granted literature
- US20210067099A1 SIGNAL COMBINER Public/Granted day:2021-03-04
Information query
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