Invention Grant
- Patent Title: Mold for forming solder distal tip for guidewire
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Application No.: US16671057Application Date: 2019-10-31
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Publication No.: US11285299B2Publication Date: 2022-03-29
- Inventor: Robert C. Hayzelden
- Applicant: ABBOTT CARDIOVASCULAR SYSTEMS INC.
- Applicant Address: US CA Santa Clara
- Assignee: ABBOTT CARDIOVASCULAR SYSTEMS INC.
- Current Assignee: ABBOTT CARDIOVASCULAR SYSTEMS INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Fulwider Patton LLP
- Main IPC: A61M25/09
- IPC: A61M25/09 ; B23K1/08 ; B22D18/02 ; B21F15/08 ; B23K3/08 ; B23K101/32 ; C23C6/00 ; B22D19/04
Abstract:
A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.
Public/Granted literature
- US20210128884A1 MOLD FOR FORMING SOLDER DISTAL TIP FOR GUIDEWIRE Public/Granted day:2021-05-06
Information query
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