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公开(公告)号：US11911051B2
公开(公告)日：2024-02-27
申请号：US16671030
申请日：2019-10-31
Applicant: ABBOTT CARDIOVASCULAR SYSTEMS INC.
Inventor： Robert C. Hayzelden , Puneet Kamal Singh Gill
CPC classification number: A61B17/22 , A61M25/09 , A61B2017/22038 , A61B2017/22094 , A61M2025/09083 , A61M2025/09108 , A61M2025/09166 , A61M2025/09191 , A61M2205/0238 , A61M2205/0266
Abstract: A guidewire for use in intravascular procedures has a solder or weld joint at a distal end thereof. A plurality of dimples are formed on the solder/weld joint to increase the engagement and penetration of fibrous material including chronic total occlusions (CTO).
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Patent Agency Ranking
公开(公告)号：US20210128181A1
公开(公告)日：2021-05-06
申请号：US16671030
申请日：2019-10-31
Applicant: ABBOTT CARDIOVASCULAR SYSTEMS INC.
Inventor： Robert C. Hayzelden , Puneet Kamal Singh Gill
Abstract: A guidewire for use in intravascular procedures has a solder or weld joint at a distal end thereof. A plurality of dimples are formed on the solder/weld joint to increase the engagement and penetration of fibrous material including chronic total occlusions (CTO).
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公开(公告)号：US20240156474A1
公开(公告)日：2024-05-16
申请号：US18416533
申请日：2024-01-18
Applicant: ABBOTT CARDIOVASCULAR SYSTEMS INC.
Inventor： Robert C. Hayzelden , Puneet Kamal Singh Gill
CPC classification number: A61B17/22 , A61M25/09 , A61B2017/22038 , A61B2017/22094 , A61M2025/09083 , A61M2025/09108 , A61M2025/09166 , A61M2025/09191 , A61M2205/0238 , A61M2205/0266
Abstract: A guidewire for use in intravascular procedures has a solder or weld joint at a distal end thereof. A plurality of dimples are formed on the solder/weld joint to increase the engagement and penetration of fibrous material including chronic total occlusions (CTO).
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公开(公告)号：US11285299B2
公开(公告)日：2022-03-29
申请号：US16671057
申请日：2019-10-31
Applicant: ABBOTT CARDIOVASCULAR SYSTEMS INC.
Inventor： Robert C. Hayzelden
Abstract: A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.
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公开(公告)号：US20220226618A1
公开(公告)日：2022-07-21
申请号：US17685767
申请日：2022-03-03
Applicant: Abbott Cardiovascular Systems Inc.
Inventor： Robert C. Hayzelden
Abstract: A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.
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公开(公告)号：US20210128884A1
公开(公告)日：2021-05-06
申请号：US16671057
申请日：2019-10-31
Applicant: ABBOTT CARDIOVASCULAR SYSTEMS INC.
Inventor： Robert C. Hayzelden
IPC: A61M25/09
Abstract: A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.
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