Invention Grant
- Patent Title: Method of fabricating a circuit board and a display device including a circuit board
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Application No.: US17064661Application Date: 2020-10-07
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Publication No.: US11287858B2Publication Date: 2022-03-29
- Inventor: Byoungyong Kim , Seongtaek Lee , Young-Min Park
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-Si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-Si
- Agency: Cantor Colburn LLP
- Priority: KR10-2019-0126925 20191014
- Main IPC: G09G3/20
- IPC: G09G3/20 ; G06F1/18 ; H01L27/32 ; G09G3/3275 ; H01L27/12 ; G06F1/16

Abstract:
A display device may include a display panel including a signal pad and a circuit board including a connection pad having a first connection pad portion and a second connection pad portion. The second connection pad portion may be thicker than the first connection pad portion and may not be overlapped with the first connection pad portion in a plan view. The connection pad may be in contact with the signal pad. A first surface roughness between the first connection pad portion and the signal pad may be greater than a second surface roughness between the second connection pad portion and the signal pad.
Public/Granted literature
- US20210109573A1 METHOD OF FABRICATING A CIRCUIT BOARD AND A DISPLAY DEVICE INCLUDING A CIRCUIT BOARD Public/Granted day:2021-04-15
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