A bonding apparatus includes adhesive sheet that includes a central adhesive portion adhered to a central portion of a first substrate and a bendable adhesive portion that surrounds the central adhesive portion in a plan view and that is adhered to an edge portion of the first substrate that extends from the central portion, a molding member that includes a top surface that overlaps the central portion and a side surface bent from the top surface and that has a curved shape and that supports the adhesive sheet through the top surface, a magnet member disposed on a first display surface of a second substrate that covers the central portion of the first substrate, and pressing balls disposed in the molding member. The pressing balls press fife central adhesive portion and the bendable adhesive portion by forming attractive force with magnet member.