Invention Grant
- Patent Title: Board-to-board interconnect apparatus including microstrip circuits connected by a waveguide, wherein a bandwidth of a frequency band is adjustable
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Application No.: US16874213Application Date: 2020-05-14
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Publication No.: US11289788B2Publication Date: 2022-03-29
- Inventor: Hyeon Min Bae , Ha Il Song , Huxian Jin
- Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Daejeon
- Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: KR Daejeon
- Agency: Dinsmore & Shohl LLP
- Agent Yongsok Choi, Esq.
- Priority: KR10-2015-0029742 20150303
- Main IPC: H01P5/107
- IPC: H01P5/107 ; H01P5/08 ; H01P1/00 ; H01P3/16 ; H01P3/08 ; H01P3/12

Abstract:
Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.
Public/Granted literature
- US20200274222A1 CHIP-TO-CHIP INTERFACE USING MICROSTRIP CIRCUIT AND DIELECTRIC WAVEGUIDE Public/Granted day:2020-08-27
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