- 专利标题: Printed circuit board (PCB) connector interface module with heat and scratch resistant coverlay and accessory system
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申请号: US16803135申请日: 2020-02-27
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公开(公告)号: US11289835B2公开(公告)日: 2022-03-29
- 发明人: Chun Wen Ooi , Jorge L. Garcia , Siew Im Low , Kay Siang Sim , Wooi Ping Teoh
- 申请人: MOTOROLA SOLUTIONS, INC.
- 申请人地址: US IL Chicago
- 专利权人: MOTOROLA SOLUTIONS, INC.
- 当前专利权人: MOTOROLA SOLUTIONS, INC.
- 当前专利权人地址: US IL Chicago
- 代理机构: Michael Best & Friedrich LLP
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H01R12/70 ; H01R12/71 ; H05K1/03 ; H05K1/09
摘要:
A printed circuit board (PCB) connector interface module and an accessory system. The module including a first layer, a second layer, and a plurality of inner layers. The first layer includes a first set of contact pads configured to electrically connect to an accessory device, and a heat and scratch resistant coverlay that is adjacent to and has a first surface that is level with a first surface of the first set of contact pads. The second layer including a second set of contact pads configured to electrically connect to an internal printed circuit board (PCB) of an electronic apparatus. The plurality of inner layers including one or more printed circuit boards (PCB) and a plurality of contact vias, wherein the plurality of contact vias electrically connect the first set of contact pads to the second set of contact pads.
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