Invention Grant
- Patent Title: Circuit board
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Application No.: US16069893Application Date: 2017-01-09
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Publication No.: US11291123B2Publication Date: 2022-03-29
- Inventor: Kyung Yul Lee , Kyung Wook Lee , Jun Sang Jeong , Yang Seok Lee , Man Kim , Joo Yul Lee , Sang Yeoul Lee
- Applicant: Samwon Act Co., Ltd. , Emot Co., Ltd. , Korea Institute of Machinery & Materials
- Applicant Address: KR Busan; KR Ansan-si Gyeonggi-do; KR Daejeon
- Assignee: Samwon Act Co., Ltd.,Emot Co., Ltd.,Korea Institute of Machinery & Materials
- Current Assignee: Samwon Act Co., Ltd.,Emot Co., Ltd.,Korea Institute of Machinery & Materials
- Current Assignee Address: KR Busan; KR Ansan-si Gyeonggi-do; KR Daejeon
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0004150 20160113
- International Application: PCT/KR2017/000255 WO 20170109
- International Announcement: WO2017/122974 WO 20170720
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/11 ; H05K3/12 ; H05K3/40 ; H05K3/24 ; H05K3/36
Abstract:
The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.
Public/Granted literature
- US20190029124A1 CIRCUIT BOARD Public/Granted day:2019-01-24
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