An embedded component package structure including a dielectric structure, a semiconductor chip, a first polymer layer, and a patterned conductive layer is provided. The semiconductor chip is embedded in the dielectric structure. The first polymer layer covers the semiconductor chip and has a first thickness, and the first thickness is greater than a second thickness of the dielectric structure above the first polymer layer. The patterned conductive layer covers an upper surface of the dielectric structure and extends over the first polymer layer, and the patterned conductive layer is electrically connected to the semiconductor chip.