Invention Grant
- Patent Title: Substrate and semiconductor package comprising an interposer element with a slot and method of manufacturing the same
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Application No.: US16905912Application Date: 2020-06-18
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Publication No.: US11296034B2Publication Date: 2022-04-05
- Inventor: Wei-Hao Chang , Yi Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/48 ; H01L23/28 ; H01L21/00 ; H05K1/00 ; H05K7/00 ; H05K1/14 ; H01L23/538 ; H01L23/31 ; H01L21/78 ; H01L21/48 ; H01L21/56 ; H01L23/498 ; H01L23/00 ; H01L25/065
Abstract:
A substrate, a semiconductor package, and a method of manufacturing the same are provided. The substrate includes an interposer element. The interposer element has a first surface and a second surface opposite to the first surface. At least two rows of pads are disposed adjacent to the first surface of the interposer element. The interposer element includes at least one slot disposed between the two rows of pads and extending from the first surface to the second surface, wherein a projection area extending from an edge of the slot to an edge of the first surface of the interpose element is nonoverlapping at least one pad.
Public/Granted literature
- US20210398907A1 SUBSTRATE, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-12-23
Information query
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