公开(公告)号：US12300681B2

公开(公告)日：2025-05-13

申请号：US17576822

申请日：2022-01-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hao Chang

IPC: H01L23/34 ,  H01L23/31 ,  H01L25/16 ,  H01L31/0216 ,  H01L31/12 ,  H05K1/02 ,  H05K1/11

Abstract: The present disclosure provides an electronic package. The electronic package includes a substrate, a first component disposed on the substrate and configured to detect an external signal, and an encapsulant disposed on the substrate. The electronic package also includes a protection element disposed on the substrate and physically separating the first device from the encapsulant and exposing the first device. The present disclosure also provides an electronic device.

公开(公告)号：US12009351B2

公开(公告)日：2024-06-11

申请号：US17525833

申请日：2021-11-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hao Chang

IPC: H01L25/16 ,  H01L21/78 ,  H01L21/82 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L21/683

CPC classification number: H01L25/162 ,  H01L21/78 ,  H01L21/82 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/12 ,  H01L24/15 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/072 ,  H01L25/074 ,  H01L25/165 ,  H01L21/6836 ,  H01L2225/1058 ,  H01L2924/181

Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate disposed over the first substrate and having a first surface facing away from the first substrate and a second surface facing the first substrate, a first component disposed on the first surface of the second substrate, a second component disposed on the second surface of the second substrate; and a support member covering the first component.

公开(公告)号：US20230208175A1

公开(公告)日：2023-06-29

申请号：US17561097

申请日：2021-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hao Chang

IPC: H02J7/00

CPC classification number: H02J7/00712 ,  H02J7/00034 ,  H02J7/0042 ,  H04R1/1025

Abstract: An electronic device package and a method for manufacturing the electronic device are provided. The electronic device includes a charging element, a housing covering the charging element and a sensing element electrically connected to the housing. The sensing element is configured to detect an external device and to drive the charging element.

公开(公告)号：US12169170B2

公开(公告)日：2024-12-17

申请号：US17730123

申请日：2022-04-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hao Chang

IPC: G01N21/17 ,  G06F3/01

Abstract: The present disclosure provides a sensing package. The sensing package includes a carrier configured to face an object to be inspected and an emitter disposed adjacent to the carrier. The emitter is configured to emit a first light propagating in a first direction. The sensing package further includes a component configured to change the first light into a second light propagating in a second direction different from the first direction. An optical module and a method for detecting light are also provided.

公开(公告)号：US11296034B2

公开(公告)日：2022-04-05

申请号：US16905912

申请日：2020-06-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hao Chang ,  Yi Chen

IPC: H01L23/34 ,  H01L23/48 ,  H01L23/28 ,  H01L21/00 ,  H05K1/00 ,  H05K7/00 ,  H05K1/14 ,  H01L23/538 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065

Abstract: A substrate, a semiconductor package, and a method of manufacturing the same are provided. The substrate includes an interposer element. The interposer element has a first surface and a second surface opposite to the first surface. At least two rows of pads are disposed adjacent to the first surface of the interposer element. The interposer element includes at least one slot disposed between the two rows of pads and extending from the first surface to the second surface, wherein a projection area extending from an edge of the slot to an edge of the first surface of the interpose element is nonoverlapping at least one pad.