Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16645665Application Date: 2018-09-05
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Publication No.: US11296085B2Publication Date: 2022-04-05
- Inventor: Yuta Endo , Hideomi Suzawa
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JPJP2017-177386 20170915
- International Application: PCT/IB2018/056756 WO 20180905
- International Announcement: WO2019/053558 WO 20190321
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L27/00 ; H01L29/00 ; H01L27/105 ; H01L27/02 ; H01L29/24 ; H01L29/66 ; H01L29/786

Abstract:
A semiconductor device that can be highly integrated is provided. The semiconductor device includes a first transistor, a second transistor, and an electrode. The first transistor and the second transistor include an oxide, a gate insulator over the oxide, and a gate. The electrode is connected to one of a source and a drain of the first transistor and one of a source and a drain of the second transistor. The channel length of the first transistor is longer than the short side of the first conductor. The channel length of the second transistor is longer than the short side of the second conductor.
Public/Granted literature
- US20200279851A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2020-09-03
Information query
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