Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US16695675Application Date: 2019-11-26
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Publication No.: US11296196B2Publication Date: 2022-04-05
- Inventor: Heon Bok Lee , Dae Yong Kim , Wan Don Kim , Jeong Hyuk Yim , Won Keun Chung , Hyo Seok Choi , Sang Jin Hyun
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2018-0152262 20181130
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/66 ; H01L29/08 ; H01L21/768 ; H01L29/78

Abstract:
A semiconductor device includes an active pattern on a substrate, the active pattern extending in a first direction, a gate electrode on the active pattern, the gate electrode extending in a second direction intersecting the first direction and including a first portion and a second portion arranged along the second direction, a first contact plug on the gate electrode, the first contact plug being connected to a top surface of the second portion of the gate electrode, a source/drain region in the active pattern on a sidewall of the gate electrode, and a source/drain contact on the source/drain region, a height of a top surface of the source/drain contact being higher than a top surface of the first portion of the gate electrode and lower than the top surface of the second portion of the gate electrode.
Public/Granted literature
- US20200176575A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2020-06-04
Information query
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