Invention Grant
- Patent Title: Holder for holding substrate and system for plating
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Application No.: US16609884Application Date: 2018-06-12
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Publication No.: US11299817B2Publication Date: 2022-04-12
- Inventor: Shota Moriyama , Matsutaro Miyamoto
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: BakerHostetler
- Priority: JPJP2017-126582 20170628,JPJP2018-079388 20180417
- International Application: PCT/JP2018/022391 WO 20180612
- International Announcement: WO2019/003891 WO 20190103
- Main IPC: C25D17/08
- IPC: C25D17/08 ; C25D21/00

Abstract:
There is provided a substrate holder for holding a substrate including a first holding member having a first opening portion for exposing a first surface of the substrate, and a second holding member configured to hold the substrate together with the first holding member and having a second opening portion for exposing a second surface of the substrate, wherein the first holding member has at least one first external connection contact, and the second holding member has at least one second external connection contact that is independent of the first external connection contact.
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