Invention Grant
- Patent Title: Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
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Application No.: US16802576Application Date: 2020-02-27
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Publication No.: US11302657B2Publication Date: 2022-04-12
- Inventor: Chia-Hao Hsu , Tai-Yu Chen , Shiann-Tsong Tsai , Hsing-Chih Liu , Yao-Pang Hsu , Chi-Yuan Chen , Chung-Fa Lee
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsin-Chu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L27/14
- IPC: H01L27/14 ; H01L23/66 ; H01L23/367 ; H01L23/373 ; H01L23/498 ; H01L23/00 ; H01Q1/02 ; H01Q1/22

Abstract:
A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.
Public/Granted literature
Information query
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