公开(公告)号：US11227846B2

公开(公告)日：2022-01-18

申请号：US16742850

申请日：2020-01-14

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Shiann-Tsong Tsai ,  Hsing-Chih Liu ,  Yao-Pang Hsu ,  Chi-Yuan Chen ,  Chung-Fa Lee

IPC: H01L27/14 ,  H01L23/66 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/02 ,  H01Q1/22

Abstract: A semiconductor package includes a base having an upper surface and a lower surface opposite to the upper surface. An antenna array structure is embedded at the upper surface of the base. An IC die is mounted on the lower surface of the base in a flip-chip manner so that a backside of the IC die is available for heat dissipation. Solder ball pads are disposed on the lower surface of the base and arranged around the IC die. The semiconductor package further includes a metal thermal interface layer having a backside metal layer that is in direct contact with the backside of the IC die, and a solder paste conformally printed on the backside metal layer.

公开(公告)号：US20200243462A1

公开(公告)日：2020-07-30

申请号：US16742850

申请日：2020-01-14

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Shiann-Tsong Tsai ,  Hsing-Chih Liu ,  Yao-Pang Hsu ,  Chi-Yuan Chen ,  Chung-Fa Lee

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/22 ,  H01Q1/02

Abstract: A semiconductor package includes a base having an upper surface and a lower surface opposite to the upper surface. An antenna array structure is embedded at the upper surface of the base. An IC die is mounted on the lower surface of the base in a flip-chip manner so that a backside of the IC die is available for heat dissipation. Solder ball pads are disposed on the lower surface of the base and arranged around the IC die. The semiconductor package further includes a metal thermal interface layer having a backside metal layer that is in direct contact with the backside of the IC die, and a solder paste conformally printed on the backside metal layer.

公开(公告)号：US20240243046A1

公开(公告)日：2024-07-18

申请号：US18402667

申请日：2024-01-02

Applicant: MEDIATEK INC.

Inventor： Chun-Yin Lin ,  Tai-Yu Chen ,  Li-Song Lin ,  Chi-Yuan Chen

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/373

CPC classification number: H01L23/49816 ,  H01L23/3735 ,  H01L23/49822 ,  H01L24/08 ,  H01L24/16 ,  H01L2224/08145 ,  H01L2224/08225 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/351

Abstract: A flip chip ball grid array package includes a package substrate and a flip chip device mounted on a top surface of the package substrate. The flip chip device includes a semiconductor integrated circuit die; an epoxy molding compound encapsulating vertical sidewalls of the semiconductor integrated circuit die; a re-distribution layer structure disposed on an active surface of the semiconductor integrated circuit die and on a lower surface of the epoxy molding compound; a sintered nanosilver layer disposed on a passive rear surface of the semiconductor integrated circuit die and on an upper surface of the epoxy molding compound; and a stiffener ring mounted around the flip chip device on the package substrate.

公开(公告)号：US20230307849A1

公开(公告)日：2023-09-28

申请号：US18113606

申请日：2023-02-23

Applicant: MEDIATEK INC.

Inventor： Ya-Jui Hsieh ,  Chi-Yuan Chen ,  Shih-Chao Chiu ,  Yao-Pang Hsu

IPC: H01Q21/08 ,  H01Q9/04 ,  H01L25/16

CPC classification number: H01Q21/08 ,  H01Q9/0407 ,  H01L25/16

Abstract: An antenna-in-module package-on-package includes an antenna package having a top surface and a bottom surface opposing the top surface. The antenna package includes a radiative antenna element on the bottom surface. A chip package is mounted on the top surface of the antenna package. The chip package includes a semiconductor chip. Conductive elements are disposed between the antenna package and the chip package to electrically interconnect the chip package and the antenna package. A radiative antenna element is disposed on the bottom surface of the antenna package. At least one air trench is disposed on the bottom surface of the antenna package.

公开(公告)号：US11705413B2

公开(公告)日：2023-07-18

申请号：US17549901

申请日：2021-12-14

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Shiann-Tsong Tsai ,  Hsing-Chih Liu ,  Yao-Pang Hsu ,  Chi-Yuan Chen ,  Chung-Fa Lee

IPC: H01L27/14 ,  H01L23/66 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/02 ,  H01Q1/22

CPC classification number: H01L23/66 ,  H01L23/3672 ,  H01L23/3733 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01Q1/02 ,  H01Q1/2283 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/0103 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/18161

Abstract: A semiconductor package including a base comprising an upper surface and a lower surface that is opposite to the upper surface; a radio-frequency (RF) module embedded near the upper surface of the base; an integrated circuit (IC) die mounted on the lower surface of the base in a flip-chip manner so that a backside of the IC die is available for heat dissipation; a plurality of conductive structures disposed on the lower surface of the base and arranged around the IC die; and a metal thermal interface layer comprising a backside metal layer that is in contact with the backside of the IC die, and a solder paste conformally printed on the backside metal layer.

公开(公告)号：US20220130734A1

公开(公告)日：2022-04-28

申请号：US17493853

申请日：2021-10-05

Applicant: MEDIATEK INC.

Inventor： Shih-Chao Chiu ,  Chi-Yuan Chen ,  Wen-Sung Hsu ,  Ya-Jui Hsieh ,  Yao-Pang Hsu ,  Wen-Chun Huang

IPC: H01L23/31 ,  H01L23/40 ,  H05K5/02 ,  H05K5/00 ,  H01L23/473

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

公开(公告)号：US20210217707A1

公开(公告)日：2021-07-15

申请号：US17111456

申请日：2020-12-03

Applicant: MEDIATEK INC.

Inventor： Yi-Lin Tsai ,  Shih-Chao Chiu ,  Wen-Sung Hsu ,  Sang-Mao Chiu ,  Chi-Yuan Chen ,  Yao-Pang Hsu

IPC: H01L23/00 ,  H01L23/498

Abstract: A semiconductor package includes a substrate component having a first surface, a second surface opposite to the first surface, and a sidewall surface extending between the first surface and the second surface; a re-distribution layer (RDL) structure disposed on the first surface and electrically connected to the first surface through first connecting elements comprising solder bumps or balls; a plurality of ball grid array (BGA) balls mounted on the second surface of the substrate component; and at least one integrated circuit die mounted on the RDL structure through second connecting elements.

公开(公告)号：US20240429113A1

公开(公告)日：2024-12-26

申请号：US18822254

申请日：2024-09-01

Applicant: MEDIATEK INC.

Inventor： Shih-Chao Chiu ,  Chi-Yuan Chen ,  Wen-Sung Hsu ,  Ya-Jui Hsieh ,  Yao-Pang Hsu ,  Wen-Chun Huang

IPC: H01L23/31 ,  H01L23/40 ,  H01L23/473 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

公开(公告)号：US20220102297A1

公开(公告)日：2022-03-31

申请号：US17549901

申请日：2021-12-14

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Shiann-Tsong Tsai ,  Hsing-Chih Liu ,  Yao-Pang Hsu ,  Chi-Yuan Chen ,  Chung-Fa Lee

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01Q1/02 ,  H01Q1/22

Abstract: A semiconductor package including a base comprising an upper surface and a lower surface that is opposite to the upper surface; a radio-frequency (RF) module embedded near the upper surface of the base; an integrated circuit (IC) die mounted on the lower surface of the base in a flip-chip manner so that a backside of the IC die is available for heat dissipation; a plurality of conductive structures disposed on the lower surface of the base and arranged around the IC die; and a metal thermal interface layer comprising a backside metal layer that is in contact with the backside of the IC die, and a solder paste conformally printed on the backside metal layer.

公开(公告)号：US20200243464A1

公开(公告)日：2020-07-30

申请号：US16802576

申请日：2020-02-27

Applicant: MEDIATEK INC.

Inventor： Chia-Hao Hsu ,  Tai-Yu Chen ,  Shiann-Tsong Tsai ,  Hsing-Chih Liu ,  Yao-Pang Hsu ,  Chi-Yuan Chen ,  Chung-Fa Lee

IPC: H01L23/66 ,  H01Q1/02 ,  H01Q1/22 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498 ,  H01L23/373

Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.