Invention Grant
- Patent Title: Modular stacked silicon package assembly
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Application No.: US16880811Application Date: 2020-05-21
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Publication No.: US11302674B2Publication Date: 2022-04-12
- Inventor: Jaspreet Singh Gandhi , Suresh Ramalingam , William E. Allaire , Hong Shi , Kerry M. Pierce
- Applicant: XILINX, INC.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00 ; H01L25/00
Abstract:
A chip package assembly and method for fabricating the same are provided that provide a modular chip stack that can be matched with one or more chiplets. The use of chiplets enables the same modular stack to be utilized in a large number of different chip package assembly designs, resulting much faster development times at a fraction of the overall solution cost.
Public/Granted literature
- US20210366873A1 MODULAR STACKED SILICON PACKAGE ASSEMBLY Public/Granted day:2021-11-25
Information query
IPC分类:
