Invention Grant
- Patent Title: Fin shaping using templates and integrated circuit structures resulting therefrom
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Application No.: US16772631Application Date: 2018-02-23
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Publication No.: US11302790B2Publication Date: 2022-04-12
- Inventor: Leonard P. Guler , Biswajeet Guha , Mark Armstrong , William Hsu , Tahir Ghani , Swaminathan Sivakumar
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2018/019456 WO 20180223
- International Announcement: WO2019/164509 WO 20190829
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/088 ; H01L29/417 ; H01L29/16 ; H01L29/20

Abstract:
Fin shaping using templates, and integrated circuit structures resulting therefrom, are described. For example, integrated circuit structure includes a semiconductor fin having a protruding fin portion above an isolation structure above a substrate. The protruding fin portion has a vertical portion and one or more lateral recess pairs in the vertical portion. A gate stack is over and conformal with the protruding fin portion of the semiconductor fin. A first source or drain region is at a first side of the gate stack. A second source or drain region is at a second side of the gate stack opposite the first side of the gate stack.
Information query
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