Invention Grant
- Patent Title: Semiconductor device with fin and related methods
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Application No.: US17087218Application Date: 2020-11-02
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Publication No.: US11302812B2Publication Date: 2022-04-12
- Inventor: Pierre Morin , Nicolas Loubet
- Applicant: STMICROELECTRONICS, INC.
- Applicant Address: US TX Coppell
- Assignee: STMICROELECTRONICS, INC.
- Current Assignee: STMICROELECTRONICS, INC.
- Current Assignee Address: US TX Coppell
- Agency: Seed IP Law Group LLP
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/78 ; H01L29/66 ; H01L29/165 ; H01L27/088

Abstract:
A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, and source and drain regions adjacent the channel region to generate shear and normal strain on the channel region. A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, source and drain regions adjacent the channel region, and a gate over the channel region. The fin may be canted with respect to the source and drain regions to generate shear and normal strain on the channel region.
Public/Granted literature
- US20210050449A1 SEMICONDUCTOR DEVICE WITH FIN AND RELATED METHODS Public/Granted day:2021-02-18
Information query
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