Invention Grant
- Patent Title: Selective laser sintering device
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Application No.: US16655215Application Date: 2019-10-16
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Publication No.: US11305456B2Publication Date: 2022-04-19
- Inventor: Yusheng Shi , Chunze Yan , Zhaoqing Li , Peng Chen , Zhufeng Liu , Jiamin Wu , Shifeng Wen , Chenhui Li , Lichao Zhang
- Applicant: Huazhong University of Science and Technology
- Applicant Address: CN Wuhan
- Assignee: Huazhong University of Science and Technology
- Current Assignee: Huazhong University of Science and Technology
- Current Assignee Address: CN Wuhan
- Agency: JCIPRNET
- Priority: CN201910447966.2 20190527
- Main IPC: B28B1/00
- IPC: B28B1/00 ; B33Y10/00 ; B33Y30/00 ; B33Y40/00 ; B29C64/153 ; B29C64/232 ; B29C64/245 ; B29C64/236 ; B29C64/35 ; B29C64/25 ; C23C16/24

Abstract:
A selective laser sintering (SLS) device. The SLS device includes a laser forming unit, a support platform and a driving mechanism. The support platform is configured to support a plurality of raw materials for additive manufacturing of an object including a plurality of sections. The laser forming unit is disposed on the support platform and is configured to lay powders on a surface of each section of the object and sinter the powders. The driving mechanism is disposed under the laser forming unit and includes a vertical driving mechanism and a horizontal driving mechanism. The vertical driving mechanism is connected to the laser forming unit and configured to lift the laser forming unit layer by layer. The horizontal driving mechanism is configured to drive the laser forming unit to move in a horizontal direction with respect to the support platform.
Public/Granted literature
- US20200376708A1 SELECTIVE LASER SINTERING DEVICE Public/Granted day:2020-12-03
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