Invention Grant
- Patent Title: Electrically conductive adhesive agent composition, and electrically conductive adhesive film and dicing-die-bonding film using the same
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Application No.: US16056932Application Date: 2018-08-07
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Publication No.: US11306225B2Publication Date: 2022-04-19
- Inventor: Shunichiro Sato , Naoaki Mihara , Jirou Sugiyama
- Applicant: Furukawa Electric Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Furukawa Electric Co., Ltd.
- Current Assignee: Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Dorsey & Whitney LLP
- Priority: JPJP2016-023614 20160210
- Main IPC: C09J9/02
- IPC: C09J9/02 ; C09J11/06 ; C09J7/35 ; H01L21/683 ; H01L23/00 ; H01B1/22 ; C09J179/08 ; C09J163/00 ; C09J157/12 ; C09J7/10 ; C09J11/02 ; C09J201/00 ; C08K3/08 ; C08K5/50 ; H01L21/78
Abstract:
The electrically conductive adhesive agent composition comprises a metal particle (Q) and a prescribed organophosphorus compound (A), and the metal particle (Q) comprises a first metal particle (Q1) made of a single metal selected from the group of copper, nickel, aluminum and tin or an alloy comprising two or more metals selected from said group.
Public/Granted literature
Information query
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