An image sensor package includes a substrate, an image sensor, a light-emitting element, and a package body. The substrate includes a plurality of first conductive contacts and a plurality of second conductive contacts. The image sensor is disposed on the substrate and electrically connected to the corresponding first conductive contacts. The light-emitting element is close to the image sensor, disposed on the substrate and electrically connected to the corresponding first conductive contacts. The package body is filled between the image sensor and the light emitting element. The above-mentioned image sensor package can achieve miniaturization, provide uniform illumination, and increase light utilization efficiency. An endoscope including the above-mentioned image sensor package is also disclosed.