公开(公告)号：US12178407B2

公开(公告)日：2024-12-31

申请号：US17957251

申请日：2022-09-30

Applicant: Medimaging Integrated Solution, Inc.

Inventor： Shangyi Wu ,  Jiunwei Chen ,  Jia-De Zhou ,  Tseng Shen Tseng

IPC: A61B1/05 ,  A61B1/00 ,  A61B1/06 ,  A61B1/07 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/173

Abstract: An image sensor package includes a substrate, an image sensor, a plurality of light-emitting elements, and a scattering layer. The substrate includes a plurality of first conductive contacts, a plurality of second conductive contacts, and a plurality of third conductive contacts, wherein the second conductive contacts and the third conductive contacts are electrically connected with the corresponding first conductive contacts. The image sensor is disposed on the substrate and electrically connected to the second conductive contacts. The light-emitting elements are disposed on the substrate and electrically connected with the third conductive contacts. The scattering layer covers at least one sidewall of the light-emitting elements. The abovementioned image sensor package can provide better illumination effects. An endoscope including the abovementioned image sensor package is also disclosed.

公开(公告)号：US11309299B2

公开(公告)日：2022-04-19

申请号：US17097714

申请日：2020-11-13

Applicant: Medimaging Integrated Solution, Inc.

Inventor： Shangyi Wu ,  Mingche Hsieh

IPC: H01L25/16 ,  H05K1/14 ,  H04N5/225 ,  A61B1/00 ,  A61B1/06 ,  H05K1/11

Abstract: An image sensor package includes a substrate, an image sensor, a light-emitting element, and a package body. The substrate includes a plurality of first conductive contacts and a plurality of second conductive contacts. The image sensor is disposed on the substrate and electrically connected to the corresponding first conductive contacts. The light-emitting element is close to the image sensor, disposed on the substrate and electrically connected to the corresponding first conductive contacts. The package body is filled between the image sensor and the light emitting element. The above-mentioned image sensor package can achieve miniaturization, provide uniform illumination, and increase light utilization efficiency. An endoscope including the above-mentioned image sensor package is also disclosed.

公开(公告)号：US12004720B2

公开(公告)日：2024-06-11

申请号：US17476808

申请日：2021-09-16

Applicant: Medimaging Integrated Solution, Inc.

Inventor： Chu-Ming Cheng ,  Shangyi Wu ,  Chia-Jung Lee ,  Chih-Lu Hsu

IPC: A61B1/05 ,  A61B1/00 ,  A61B1/005 ,  A61B1/06 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/173 ,  A61B1/018

CPC classification number: A61B1/051 ,  A61B1/0011 ,  A61B1/00124 ,  A61B1/0057 ,  A61B1/0676 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/173 ,  A61B1/018

Abstract: A packaged image sensor includes a substrate, an image sensor, a light-emitting element, and a first encapsulant. The substrate includes a through-hole. The image sensor and the light-emitting element are disposed on the substrate and are electrically connected to the substrate. The first encapsulant is filled between the image sensor and the light emitting element, and keeps the through-hole of the substrate opened. The through-hole of the substrate of the above-mentioned packaged image sensor can define a relative position between a pipe and the image sensor to facilitate the subsequent packaging process. An endoscope including the above-mentioned packaged image sensor is also disclosed.

公开(公告)号：US12004719B2

公开(公告)日：2024-06-11

申请号：US17535867

申请日：2021-11-26

Applicant: Medimaging Integrated Solution, Inc.

Inventor： Shangyi Wu ,  Chu-Ming Cheng

IPC: H04N5/335 ,  A61B1/05 ,  G02B23/24 ,  H01L27/146

CPC classification number: A61B1/05 ,  G02B23/2415 ,  G02B23/2484 ,  H01L27/14636

Abstract: An image sensor package includes a first substrate, an image sensor, a second substrate, a light-emitting element, and a first encapsulant. The image sensor is disposed on and electrically connected with the first substrate. The second substrate is disposed on and electrically connected with the first substrate, wherein the second substrate includes an accommodating portion and the image sensor protrudes from the second substrate via the accommodating portion. The light-emitting element is disposed on the second substrate and close to the image sensor, and is electrically connected to the second substrate. The first encapsulant is filled in a space between the image sensor and the light-emitting element. The abovementioned image sensor package can achieve miniaturization and provide better illumination. An endoscope including the abovementioned image sensor package is also disclosed.

公开(公告)号：US11986149B2

公开(公告)日：2024-05-21

申请号：US17407784

申请日：2021-08-20

Applicant: Medimaging Integrated Solution, Inc.

Inventor： Chu-Ming Cheng ,  Shangyi Wu

IPC: A61B1/00 ,  A61B1/05 ,  A61B1/06

CPC classification number: A61B1/0008 ,  A61B1/05 ,  A61B1/0684

Abstract: A packaged image sensor includes a first pipe and a second pipe, wherein the first pipe with a shorter length is initially encapsulated with an image sensor and a light-emitting element to define a relative position between the first pipe and the image sensor. The second pipe is connected to the first pipe and then is encapsulated in a second encapsulation process. The abovementioned packaged image sensor is easy to manufacture. An endoscope including the abovementioned packaged image sensor is also disclosed.