- Patent Title: Radio wave absorber and manufacturing method of radio wave absorber
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Application No.: US16578527Application Date: 2019-09-23
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Publication No.: US11316279B2Publication Date: 2022-04-26
- Inventor: Tatsuo Mikami
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2017-065330 20170329
- Main IPC: H01Q17/00
- IPC: H01Q17/00 ; H05K9/00

Abstract:
A radio wave absorber including: a support; and a linear absorber that is disposed on at least one surface of the support, has an occupancy per unit volume on the support of 0.05 to 0.70, includes a radio wave absorption material and a binder, and has a maximum length on a cross section perpendicular to a longitudinal direction of 25% or less of a wavelength of the radio wave, and a manufacturing method thereof.
Public/Granted literature
- US20200169000A1 RADIO WAVE ABSORBER AND MANUFACTURING METHOD OF RADIO WAVE ABSORBER Public/Granted day:2020-05-28
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