Invention Grant
- Patent Title: Ultrasonic joining method and arrangement
-
Application No.: US16803201Application Date: 2020-02-27
-
Publication No.: US11318688B2Publication Date: 2022-05-03
- Inventor: Georg Troska , Olga Simon
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: EP19161266 20190307
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B29C65/08

Abstract:
A method for joining at least two joining partners includes performing a plurality of ultrasonic joining operations in direct succession, wherein performing an individual ultrasonic joining operation includes, with a second joining tool, applying pressure to a second joining partner arranged adjacent to a first joining partner, thereby pressing the second joining partner against the first joining partner, and, with the second joining tool, applying high-frequency ultrasonic vibrations to the joining partners. The method further includes, during at least one intermediate time interval between two directly successive ultrasonic joining operations, at least one of actively cooling and heating the second joining tool.
Public/Granted literature
- US20200282663A1 Ultrasonic Joining Method and Arrangement Public/Granted day:2020-09-10
Information query