Invention Grant
- Patent Title: Integration of power and optics through cold plate for delivery to electronic and photonic integrated circuits
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Application No.: US16842393Application Date: 2020-04-07
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Publication No.: US11320610B2Publication Date: 2022-05-03
- Inventor: Joel Richard Goergen , Ashley Julia Maker Erickson
- Applicant: CISCO TECHNOLOGY, INC.
- Applicant Address: US CA San Jose
- Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee: CISCO TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/42 ; H01L23/00 ; H01L23/367 ; H01L25/16
Abstract:
In one embodiment, an apparatus includes a cold plate comprising a first side and a second side, a photonic integrated circuit connected to a substrate positioned on the second side of the cold plate, and an optical path extending through the cold plate and optically coupled to the photonic integrated circuit for transmitting an optical signal between the photonic integrated circuit and the first side of the cold plate.
Public/Granted literature
Information query
