公开(公告)号：US20210311269A1

公开(公告)日：2021-10-07

申请号：US16842393

申请日：2020-04-07

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Joel Richard Goergen ,  Ashley Julia Maker Erickson

IPC: G02B6/42 ,  H01L25/16 ,  H01L23/00 ,  H01L23/367

Abstract: In one embodiment, an apparatus includes a cold plate comprising a first side and a second side, a photonic integrated circuit connected to a substrate positioned on the second side of the cold plate, and an optical path extending through the cold plate and optically coupled to the photonic integrated circuit for transmitting an optical signal between the photonic integrated circuit and the first side of the cold plate.

公开(公告)号：US20210219415A1

公开(公告)日：2021-07-15

申请号：US16743371

申请日：2020-01-15

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Joel Richard Goergen ,  Jessica Kiefer ,  Ashley Julia Maker Erickson ,  Yi Tang ,  M. Baris Dogruoz ,  Elizabeth Ann Kochuparambil ,  Shobhana Punjabi

IPC: H05K1/02 ,  H05K7/20 ,  H01R12/71

Abstract: In one embodiment, an apparatus includes a substrate comprising a first surface and a second surface opposite to the first surface, an integrated circuit attached to the first surface of the substrate, and a cold plate attached to the second surface of the substrate with an electrical path extending through the cold plate for transmitting power from a power component connected to the cold plate, to the integrated circuit.

公开(公告)号：US11320610B2

公开(公告)日：2022-05-03

申请号：US16842393

申请日：2020-04-07

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Joel Richard Goergen ,  Ashley Julia Maker Erickson

IPC: G02B6/12 ,  G02B6/42 ,  H01L23/00 ,  H01L23/367 ,  H01L25/16

Abstract: In one embodiment, an apparatus includes a cold plate comprising a first side and a second side, a photonic integrated circuit connected to a substrate positioned on the second side of the cold plate, and an optical path extending through the cold plate and optically coupled to the photonic integrated circuit for transmitting an optical signal between the photonic integrated circuit and the first side of the cold plate.

公开(公告)号：US11252811B2

公开(公告)日：2022-02-15

申请号：US16743371

申请日：2020-01-15

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Joel Richard Goergen ,  Jessica Kiefer ,  Ashley Julia Maker Erickson ,  Yi Tang ,  M. Baris Dogruoz ,  Elizabeth Ann Kochuparambil ,  Shobhana Punjabi

IPC: H05K1/02 ,  H01R12/71 ,  H05K7/20

Abstract: In one embodiment, an apparatus includes a substrate comprising a first surface and a second surface opposite to the first surface, an integrated circuit attached to the first surface of the substrate, and a cold plate attached to the second surface of the substrate with an electrical path extending through the cold plate for transmitting power from a power component connected to the cold plate, to the integrated circuit.